EU in touch with Telegram as it nears criterion for EU tech rules Posted on 05/29/202405/29/2024 by ER
Polish game developer CD Projekt posts 44% first-quarter profit jump Posted on 05/29/202405/29/2024 by ER
Samsung achieves technical breakthrough, stacking 3D DRAM to 16 layers Posted on 05/29/202405/29/2024 by ER
Samsung eyes rolling out 1,000-layer 3D NAND by 2030 with new material Posted on 05/29/202405/29/2024 by ER
Loongson's next-generation CPU on par with Intel's Core i5, says Chairman Hu Weiwu Posted on 05/29/202405/29/2024 by ER
China unveils semiconductor standards, potentially creating distinct ecosystem Posted on 05/29/202405/29/2024 by ER
Russia to produce 350nm chips with its self-developed EUV lithography machines in 2024, says Chinese media Posted on 05/29/202405/29/2024 by ER